Wafer Level Test Solutions

During the massive growth of WLCSP in the semiconductor market, over 30 different kinds of probe heads were designed to meet the demand of the market. A Pogo-Pin design improves the durability of the probe head significantly. Additionally, coplanarity errors induced by differently sized solder balls can be avoided by our Pogo-Pins which have a working-travel designed for up to 250um. We offers a wide variety of head types to accommodate the different fields of application. A full list of head types with detailed description can be found in our catalog.